Vapour-Phase-Soldering

The vapour-phase soldering is most suitable for every kind of SMD-components and carrier materials. All electric devices can be handled without complex calculation and without observance of temperature profiles. The heat transmission results by a chemical inert liquid - a harmless and stable liquid - which do not coalesce with other substances. The boiling liquid produces a cover of saturated steam. When bringing the soldering goods in this vapour zone the steam precipitates on the soldering goods and transmits his corresponding heat. Indifferent how long the soldering goods are in the steam the temperature is never higher than the temperature of the steam. Therefore, the soldering process is reliably reproduceable and controllable.

 

 

Vapour-phase-soldering guarantees:
- absolutely constant, reproduceable process conditions
- that overheating of the components is excluded
- equal distribution of temperature on the whole component
- that delamination of the printed circuit board is excluded
- that all component (also Ball Grid Arrays) can be securely soldered
- simple repair soldering without destroying the printed circuit board
- integrated cooling station to minimize the growing of intercrystalline phases
- eco-friendliness as no aggressive soldering gases are produced